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within PBdB<0.35Transmission IL variation within PBdB<0.25Reflection isolation within PBdB>13Transmission PDL within PBdB<0.1CW temp.sensitivitypm/℃<2Reflection(AR coating on backside）%<0.2A.O.I.°13.5Dimension (L*W)mm1.4±0.05 * 1.4±0.05Thicknessmm1.0 ± 0.05...
within PBdB<0.35Transmission IL variation within PBdB<0.30Reflection isolation within PBdB>12Transmission PDL within PBdB<0.15CW temp. sensitivitypm/℃<2Material WMS-15Reflection（AR coating ）%<0.2A.O.I. °13.5±0.3Dimension (L*W)mm0.75(±0.03)*0.75(±0.03)Thicknessmm0.80(±0...
within PBdB<0.35 in glassTransmission IL variation within PBdB<0.25 in glassReflection isolation within PBdB>13Transmission PDL within PBdB<0.1CW temp. sensitivitypm/℃<2Reflection (AR coating on backside)%<0.2A.O.I.°8±0.3 / 13.5±0.3Dimension（L*W）mm(0.75±0.05) *&nbs...
within PBdB<0.35 in glassTransmission IL variation within PBdB<0.25 in glassReflection isolation within PBdB>13Transmission PDL within PBdB<0.1CW temp. sensitivitypm/℃<2Reflection (AR coating on backside)%<0.2A.O.I.°8±0.03 Dimension (L*W)mm(1.4±0.05) * (1.4±0.05)...
within PBdB<0.35Transmission IL variation within PBdB<0.25Reflection isolation within PBdB>13Transmission PDL within PBdB<0.1CW temp. sensitivitypm/℃<2Reflection（AR coating on backside）%<0.2A.O.I.°8±0.3 / 13.5±0.3Dimension (L*W)mm0.77(±0.03)* 1.0(±0.03)or CustomizationThick...
within PBdB<0.35Transmission IL variation within PBdB<0.25Reflection isolation within PBdB>13Transmission PDL within PBdB<0.1CW temp.sensitivitypm/℃<2Reflection (AR coating on backside）%<0.2A.O.I.°1.8Dimension (L*W)mm(1.4±0.05) * (1.4±0.05)Thicknessmm1.0 ± 0.05...
with FBG frequency locking.The drive circuit and TEC control ensure the safe operation of the laser,and the output power and spectrum stability.Suitable as a pumped laser source for fiber lasers or EDFA fiber amplifiers,can provide the benchtop or modular packages. 〖性能参数Performance Parameter〗...
withoutY=WitN=withoutY=with1310=1310nm1550=1550nm 2004=2004nmetcS=SMFiberP=PMFiberM=MMFiber1=1mw10=10mw 50=50mwetcFC/UPCFC/APCetc...
产品亮点 S SOA芯片全国产，工艺自主可控 S 与主流SOA厂家结构尺寸一致，兼容性强 S 性价比高，交期短，供货快，需求订制，快速迭代 产品应用 S 蝶形或小box封装的半导体光放大器，用于40G/100G高速业务的光放大 S 集成在100G光模块的ROSA中，提高光功率预算 S 硅...
产品特点 S 芯片COC全工艺国产，自主可控 S 与主流厂家结构尺寸一致，兼容性强 S 性价比高，交期短，供货快，需求订制，快速迭代 产品应用 S 蝶形或小box封装的SOA，用于高速业务信号的光放大 S 集成在100G光模块的ROSA或TOSA中，提高光功率预算 S 用于硅光子集成...
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